The UV laser cutting machine is used in cutting,opening the window and uncovery for CVL/FPC/RF and thin multilayer board, as well as cutting a variety of substrates, such as ceramic, silicon etc.
UV Laser Cutting Sample:
A : Two tables to cycle working one by one,no preparing time,high processing efficiency.
B : Preview function before processing to avoid damaging sample.
C : Bar code marking function.
Specification of UV Laser Cutting Machine
|
Model
|
JG16C
|
Wavelength
|
355nm
|
Laser Power
|
Standard 10W,Option 15W
|
Laser Frequency
|
30-120kHz
|
Maximum Processing Size
|
650mm x 550mm
(Double platforms)
|
Maximum Operating Speed
|
800mm/s
|
Positioning Accuracy of Table
|
±3μm
|
Repetitive Positioning Accuracy of Table
|
±1μm
|
Total Accuracy
|
±20um
|
light spots
|
20±5μm
|
Scanning range
|
45mmx45mm
|
File Format
|
*.gbr & *.dxf & *.lay
|
Electric Power Supply
|
AC220V/2kW; AC380V/5.5kW
|
Dimensions(L x W x H)
|
1780mmx1610mmx1650mm
|
Weight
|
3600kg
|
Environmental Temperature
|
20±2℃
|
Environmental Humidity
|
≤60%RH, Non-condensing
|
Ground Amplitude
|
≤5μm
|
Ground Pressure
|
≥1000Kgf/m2
|