Pico Laser Cutting Machine JG32

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Pico Laser Cutting Machine JG32

Product Name: Pico Laser Cutting Machine
Model Number: JG32
Certification: CE
Place of Origin: China
Packaging Details: Wooden Carton

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Usage
Features
Parameters
Video

USAGE：

The machine is used in cutting for CVL/FPC/RF and thin multilayer board, as well as cutting a variety of substrates,such as ceramic, silicon, aluminium foil, teflon etc.

Applications:

Focus on flexible PCB,cover layer,golden finger,ceramic,crystal cutting and drilling.

(1) Slight carbonization :

Carbonization is much weaker compared with nanosecond laser processing.

(2) Faster speed:

Processing speed increased several times compared with nanosecond processing.

(3)Cutting effect:

The processing surface is more smooth, neat, clean;

(4)More applications:

In addition to the traditional circuit board polymer and copper foil processing, picosecond can also process ceramics, silicon,Teflon and other materials.

(5)High intelligent :

Support EMCS, MES system. Automatically choose the cutting graphics unit by using identification of 2D bar code .

Specification of picosecond laser cutting machine
Applied Range		FPC，CVL，FPC, micro-connection, ceramics, silicon and so on
System Processing Accuracy		( ZHENGYE Conditions) ±20μm
Laser power		15W@400kHz
Laser Wavelength		355nm
Pulse Width		10ps
Frequency Range		4kHz-1MHz
Objects	Large processing size	550mmX650mm
	Table number	Single beam, Dual platform
Dimensions (L×W×H)		2200mm×2150mm×1750mm
Weight		3700kg

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Pico Laser Cutting Machine JG32

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