The machine is used in cutting,opening the window and uncovery for CVL/FPC/RF and thin multilayer board, as well as cutting a variety of substrates, such as ceramic, silicon etc.
UV Laser Cutting Sample:
1.Precision:Adopting linear motor module,servo control, sizing compensation, optical positioning and secondary positioning technologies.
2.High quality: Little carbonization and high density graphics cutting.
3.Highly intelligent,efficient:With multi-panels cutting,auto-positioning,auto-correcting,automatic sizing compensation and exclusive cutting previews functions.