Solution
Pico Laser Cutting Machine that FPC New Processing Method!
Zhengye Technology Pico Laser Cutting Machine is widely used and has obvious features. It is another great tool for material processing.
(1) The Use of Picosecond Laser Cutting Machine:
Suitable for cover film (CVL), flexible board (FPC), soft and hard bonded board (RF) and thin multi-layer board cutting and forming, and window box cover; expandable for cutting various substrates, such as ceramics, Silicon wafers, etc.
Really cold processing, basically no carbonization;
High efficiency, relative to nanosecond processing, cutting speed can be increased several times;
Double countertops, zero loading and unloading time, improve processing efficiency;
Preview function before processing to avoid scrapping the cutting board;
Carbonization is extremely weak compared to nanosecond laser processing;
Compared to nanosecond processing, the speed can be increased several times;
The processing surface is more fine, smooth, tidy and clean;
In addition to traditional circuit board polymer materials and copper foil processing, picoseconds can also be processed, ceramics, silicon wafers, Teflon and other materials;
Support EMCS, MES system, use the identification of two-dimensional code to automatically select and cut the graphics unit;
