With the development of flexible electronic material boards in the direction of high density, in addition to the smaller and smaller aperture requirements, the accuracy of drilling position has also been increased. At present, the position accuracy of UV laser drilling machine is generally required to be in the range of ±25 μm, and the precision of the future drilling position must reach ±10 μm or less. At the same time, higher processing efficiency is required. How to accurately control the drilling position under the premise of ensuring a sufficiently fast processing speed is one of the difficulties in FPC laser-based micro-hole drilling in this product.

In the process of research, it is necessary to carry out detailed and in-depth research on the factors that affect the accuracy of drilling positioning, such as the positioning accuracy and repeatability of the work platform, the adjustment level of the optical path, the positioning accuracy of the vision system, and the flatness of the adsorption platform to accurate control and optimization of hole positioning accuracy.