Equipment principle

By using high-energy laser sources and precise control of the laser beam for drilling, the processing speed can be effectively increased and accurate machining results can be obtained. Mainly used in HDI board, flexible board UV-ultraviolet laser drilling first-order blind hole, second-order blind hole, through hole, its drilling speed, hole quality, reliability and stability.

Equipment core applications

(1) Laser drilling blind via that are most suitable for drilling flexible circuit boards:

Through Hole: Laser Processing for Almost All Kinds of Soft Board Materials

Blind hole: Validity of Cu12PI25Cu12, Cu12PI50Cu12, Cu12PI50Cu12, Cu18PI50Cu18 is OK, plus Epoxy and Acrylic glue test, the amount of shrinkage can be controlled within ±5um to meet customer needs.

(2)UV laser cutting of cover film, low carbonization

(3) HDI hard hole punching

(4) UV laser opening of hard and soft circuit boards, blind cut, blind cut depth fluctuations of about ± 100um