The Advantages of UV Laser Processing

UV laser processing is especially suitable for the cutting and marking for hard, rigid flex board, soft board and its accessories. So what are the advantages of the UV laser process?

In micro drilling in PCB industry, UV laser machine exhibits a significant technological advantage. According to the thickness of the circuit board materials, laser cutting one or more times along the desired contour.The thinner, the faster. If the laser pulse is lower than that of penetrating material the required laser pulse accumulation, only scratches on the surface of the material. Therefore, it can mark two-dimensional code or bar code on the material, in order to follow the process of information tracking. The line and the solder joint near the edge is intact, no burr. Not limited to the processing of the circuit board, UV laser system can be completed at cutting, direct writing and drilling for LTCC components at the same time.

Because of the short of UV laser wavelength, it can be applied to most of the materials. For example, in the field of electronics, which can be used for the follow:

- TCO/ITO glass and the substrate without damage

- Drilling in flexible or thin material

- Window cutting on solder layer or coating

- Grooving

- Repair of assembled or in-assembly circuit board

- Cutting sintered ceramic

- Precision cutting LTCC