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Analysis Of UV Laser Drilling And UV Laser Cutting Technology In FPC Industry
UV laser cutting and punching technology has been widely used in PCB and FPC industry at present, and complete industrial standard processes have been formed both in foreign countries and in China. American ESI company is currently the leading benchmarking enterprise in PCB / FPC laser cutting machine and punching industry in the world, and it has always been in the top position in the global market share. Chinese market used to be the dominant situation of American ESI laser equipment. In recent years, many Chinese local laser enterprises have been supported by the state and made rapid progress in this area, breaking the monopoly situation of foreign countries in PCB / FPC industry in ultraviolet laser cutting and punching equipment.

According to the related information of China's optical and optoelectronic industry network, the FPC processing and molding market in China has maintained an annual growth rate of more than 20 % in recent years, and the output value in 2013 was about 266 million yuan. FPC drilling is the main process stage of FPC molding, and the quality of micropores directly affects the mechanical assembly performance and electrical connection performance of flexible electronics material board, and drilling occupies 35 % time and cost of the whole production. With the development of electronic products in the light, thin, short and small direction, FPC has also been developing in the direction of high density. The number of micropores on the same floor is as high as more than 50,000, and a large number of micropore processing requirements provide a huge market for UV laser drilling service, at the same time, higher requirements are put forward for drilling technology.


UV Laser Cutting Machine

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