Use The machine is used in cutting,opening the window and uncovery for CVL/FPC/RF and thin multilayer board, as well as cutting a variety of substrates, such as ceramic, silicon etc.
Features The machine is used in cutting,opening the window and uncovery for CVL/FPC/RF and thin multilayer board, as well as cutting a variety of substrates, such as ceramic, silicon etc.
Parameters The machine is used in cutting,opening the window and uncovery for CVL/FPC/RF and thin multilayer board, as well as cutting a variety of substrates, such as ceramic, silicon etc.